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Thermal spelling: The breaking or cracking or peeling off the refractory is known as spelling. A good refractory must show a good resistance to thermal spelling. Thermal spelling can be decreased by minimizing the development of internal stress by:
(1) Using refractory with high porosity, good thermal conductivity and low coefficient of expansion.
(2) Avoiding sudden temperature changes.
(3) Proper furnace design
A company is using a piece of equipment which originally cost $30,000. The equipment has been in use for 5 years, and now has a net realizable value of $6000. At the time of instal
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Hall effect can be used to measure (A) Mobility of semiconductors. (B) Conductivity of semiconductors. (C) Resistivity of semiconductors.
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