Surface Mount Devices (SMDs) are new components designed with soldering pads or short leads. They are much smaller in size as compared to leaded components. The SMDs are directly attached or inserted on the surface of the PCB and then soldered. In the conventional PCB assembly method, the components have leads for insertions into the holes made for the purpose into the boards and are soldered on opposite side of the board. But in surface mount device the components or devices are called surface mount components have leads small then the conventional components which can be soldered on the foot print of the broad directly. In other words in surface mount technology, holes are not drilled and components (specially manufactured) are soldered on the copper side of the board. Chip capacitors, chip resistors, chip inductors are the examples of passive SMDs, while SO-8, So-28, SOT-23 chip carriers are examples of active SMDs. The chip capacitors are multi layer ceramic in value from 1Pf to 1μf or tantalum type with value from 0.22μf to 10μf. The chip resistors are either thick film or thin film type and are available with 1% accuracy. Chip inductors of few mH are available.

ADVANTAGES OF SMDs:

Reduced size and weight. Lower cost. Save lead pre-forming. Components can be maintained from both sides of PCB. Automated high yield production. One machine places most of the components. Smaller production and small area. Smaller size, leadless, low cost. Improved high frequency performance. High dimensions standards. Short interconnections. Better performance. Improved area efficiency. Easy to use computer aided design and manufacture method.

DISADVANTAGES OF SMDs:

Repairs difficult. Generally ultra low power products. Completely new production method and investment. Very high starting costs. New technology, new reliability profile, new problems. Investment in quantity and reliability testing. Difficult to assemble odd shaped components. Must use tape mounted components. Totally new specifications. Needs new manufacturing facilities. Limited power handling. Bread boarding is difficult due to greater power density. PCB heats up. Need new interconnection systems. Unavoidable temperature gradients.