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Relation between dissipation factor and Q factor
my course is master in telecommunication and i need it today is it possible?
limitations of nernsts law
Q. Describe briefly the following methods of forging : (i) Drop forging (ii) press forging Ans. (i) Drop Forging: It is also called die
Q. Discuss briefly the causes and remedies of misrun and cold shunts casting Cold Shunt and Misrun : When the metal is unable to fill the mould cavity completely and t
Here, it is assumed that the crack is effectively longer than the value measured on the side of the specimen. If one assumes that it is longer by an amount Δ, then the new crack le
explain elecrochemical series and give its applications
find IDFT of the sequence X(k)={5,0,1,-j,0,1,0,1,j,0}
Q. What do you understand by directional solidification? What is gating system? Describe, giving sketches, various types of gates. What are the advantages and disadvantages of pres
THE IDEAL OPERATIONAL AMPLIFIER Although the characteristics of an ideal operational amplifier are unattainable, modern integrated circuit types can provide an extremely close
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