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Outline a procedure for photolithography in the fabrication of electronic devices. What are the limitations of this procedure?
Photolithography is the process of transferring geometric shapes on a mask to the Surface of semiconductor water. The steps includes in the photolithographic process are wafer cleaning; barrier layer formation; photo resist application; soft baking; mask alignment; exposure and development; and hard-baking.
A gas stream containing solute A at mole fraction of 0.02 is to be cleaned by absorbing 90% of the solute into a liquid stream in a countercurrent packed bed gas-liquid absorber. T
An operator tells you that it takes 2 minutes for a process to get half way to the final value after a step change in the input. What can you infer about the process time constant
Projection Printing Projection printing, keep away from mask damage entirely. An image of the patterns on the mask is projected onto the resist-coated wafer, which are many cen
Could I get a code on designing electrolytic reactors in the production of sodium ?
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In what manner hot worked and cold worked products differ? Hot working of a metal is carried out above its re-crystallization temperature. In this case the metal is not strain
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Ammonia is oxidized with air to form nitric oxide in the first step to produce nitric acid. The reaction occurs in a well insulated continuous reactor based on the stoichiometry:
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