Metal film resistor, Physics

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MANUFACTURING: Nickel film is deposited on ceramic substrate. This is done by electrolytic deposition of nickel in a chemical bath containing hypophosphate. The sheet resistance is controlled by the amount of nickel and Ni-P alloys depositing on substrate.

SPECIFICATIONS:

Ohm values                                                                         0.2 ohm/sq. Cm to 10000 ohm/sq. Cm

Tolerances                                                                           > 2%

Stability                                                                               2%

Temperature coefficient of resistance                                       <+200 ppm /0C

Working voltage                                                                    300 volts

Working temperature                                                             -40 to 1500C

APPLICATIONS: Photolithographic techniques are used to manufacture this type of resistor. Alloy of nickel and chromium in a ratio 80: 20 or 50: 50 are deposited on ceramic substrate by sputtering in vacuum. Then a resistive film pattern of predetermined length and width is etched out with the help of masks. This process is cost-effective for mass production. Very low mass production. Very low temperature coefficient of resistance and stability are attained by adding small quantities of copper, aluminium, or iron.

SPECIFICATIONS:

Ohm range                                                                           1 ohm/sq-cm to 5 kilns-ohms/sq-cm

Temperature coefficient of resistance                                                                    50 ppm /0C

APPLICATIONS: There are used in semi-precision and precision applications.


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