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Explain the various steps required in the fabrication of an integrated circuit.
Lithography: The method for pattern definition by applying thin uniform layer of viscous liquid (photo-resist) on the wafer surface.
Etching: Selectively deleting unwanted material from the surface of the wafer. The pattern of the photo-resist is transferred to the wafer by means of etching agents.
Deposition: Films of the several materials are applied on the wafer.
Chemical Polishing: A planarization method by applying chemical slurry with etchant agents to the wafer surface.
i am doing project on design of absorption column for the removal of n204 from atmospheric air..please help me
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what is complexometric titration?
given the displacement vectors A(3^i-4^j+4^k)m and B(2^i+3^j-7k)m,find the magnitudes of the vectors (a)C=A+B and (b)D=2A-B,also expressing each in terms of its rectangular compone
Wet air containing 4.0 mole% water vapor at 76°F and 14.8 psia is passed through a column of calcium chloride pellets. The pellets absorb 97% of the water and none of the other con
What is Metallisation Metallisation : metalizing is the procedure of evaporating a film of metal onto products. Normally the same is done in vacuum, therefore called vacuum m
1. a)Explain the construction and working of catalytic converter with a neat diagram. b) How much of rise in temperature of water occurs when 0.222 kg of a fuel is burnt in bom
molecular view of solution explanation
what is proportion of austenite present at 724 centigrade
why only size influence the movement of protein in sds page
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