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Explain the various steps required in the fabrication of an integrated circuit.
Lithography: The method for pattern definition by applying thin uniform layer of viscous liquid (photo-resist) on the wafer surface.
Etching: Selectively deleting unwanted material from the surface of the wafer. The pattern of the photo-resist is transferred to the wafer by means of etching agents.
Deposition: Films of the several materials are applied on the wafer.
Chemical Polishing: A planarization method by applying chemical slurry with etchant agents to the wafer surface.
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1 ΔS on rapid decompression Steam at 400C, 100 bar in an insulated cylinder is suddenly decompressed to 10 bar, by unlocking the piston and allowing the gas to expand, with a c
What are its applications? (i) Direct extrusion: The billet is placed in a container and forced by the die through a piston. (ii) Indirect extrusion: The extruded part
what is complexometric titration?
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Which one of the following statements is correct? You may wish to examine a molecular model of this compound. 1. Carbon D is an asymmetric center and its configuration is R 2
The similar system is now heated in two stages, by rst contacting with a reservoir at T2 halfway among T1 and Tf , then by contacting with the reservoir at Tf . Again and the ent
cristallinity of PVDF
A pair of one cation and one anion missing in a crystal of the type AB is known as Schottky defect.
Explain the Fermi energy The Fermi energy generally refers to the energy of the highest get quantum state in a system of fermions at absolute zero temperature.
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