Extrinsic material, Electrical Engineering

Assignment Help:

Extrinsic Material

  • In addition to thermally generated carriers, it is possible to create carriers in the semiconductor by purposely introducing impurities into the crystal => doping.
  • Most common technique for varying the conductivity of semiconductors.
  • By doping, the crystal can be made to have predominantly electrons (n-type) or holes (p- type).
  • When a crystal is doped such that the equilibrium concentrations of electrons (n0) and holes (p0) are different from the intrinsic carrier concentration (ni), the material is said to be extrinsic.
  • Doping creates additional levels within the band gap.
  • In Si, column V elements of the periodic table (e.g., P, As, Sb) introduce energy levels very near (commonly 0.03-0.06 eV) the conduction band.
  • At 0 K, these levels are filled with electrons, and very little thermal energy (50 K to 100 K) is required for these electrons to get excited to the conduction band.
  • Since these levels donate electrons to the conduction band, they are referred to as the donor levels.
  • Thus, Si doped with donor impurities can have a significant number of electrons in the conduction band even when the temperature is not sufficiently high enough for the intrinsic carriers to dominate, i.e., n0>> ni, p0 => n-type material, with electrons as majority carriers and holes as minority carriers.
  • In Si, column III elements of the periodic table (for example, B, Al, Ga, In) introduce energy levels very near (commonly 0.03-0.06 eV) the valence band.
  • At 0 K, these levels are empty, and very little thermal energy (50 K to 100 K) is required for electrons in the valence band to get excited to these levels, and leave behind holes in the valence band.
  • Since these levels accept electrons from the valence band, they are referred to as the acceptor levels.
  • Thus, Si doped with acceptor impurities can have a significant number of holes in the valence band even at a very low temperature, i.e., p0>> ni, n0 =>, p-type material, along with holes as majority carriers and electrons as minority carriers.
  • The extra electron for column V elements is loosely bound and it can be liberated very Easily => ionization; thus, it is free to participate in current conduction.
  • Similarly, column III elements create holes in the valence band, and they can also participate in current conduction.
  • Rough calculation of the ionization energy can be made based on the Bohr's model for H2 atoms, considering the loosely bound electron orbiting around the tightly bound core electrons. Thus,

    1536_Extrinsic Material.png

Where εr is the relative permittivity of Si.


Related Discussions:- Extrinsic material

Switching characteristics during turn off, Switching Characteristics During...

Switching Characteristics During Turn off The techniques  used for turning off a thyristor is known  as  commutation techniques. A  thyristor can be can be  turn off by reducin

Draw and explain diode clipping circuit, Q. Draw and explain diode clipping...

Q. Draw and explain diode clipping circuit ? A diode clipping circuit can be used to limit the voltage swing of a signal. Clipper circuits are used to clip a portion of the w

Impedance heating system, Under what circumstances is individual circuit pr...

Under what circumstances is individual circuit protection for a lighting and applications panel board not required? What is the purpose of guarding runway contact conductors and

1-phase half bridge inverters, 1- Φ Half Bridge Inverters 1-Φ bridge  ...

1- Φ Half Bridge Inverters 1-Φ bridge  inverter may be  of two  type 1-? half  bridge  and 1-? full  bridge  inverter. 1-? half bridge  inverter with resistive load to explain

What are the drawbacks of microprocessor, There is a limitation on the size...

There is a limitation on the size of data. Most Microprocessor does not maintain floating-point operations.

Combinational circuit, design a combinational ckt ,which detect whatever a ...

design a combinational ckt ,which detect whatever a no.(in binary) is divisable by 3 or 4

Short-term measures for technical loss reduction, Short-Term Measures for T...

Short-Term Measures for Technical Loss Reduction The short-term measures involve measures needs for immediate improvement and reduction of losses within the system. These are

What is meant by thermal runaway, Q. What is meant by Thermal Runaway? Expl...

Q. What is meant by Thermal Runaway? Explain with reference to a transistor.How is it avoided in circuits? The collector current of a transistor increases with increasing tempe

Give the basic structure of a basic dma module, a) Give four features that ...

a) Give four features that were traditionally reserved to RISC architectures? b) Determine the overall throughput for 21 sequential instructions assuming a four-stage pipeline a

Write Your Message!

Captcha
Free Assignment Quote

Assured A++ Grade

Get guaranteed satisfaction & time on delivery in every assignment order you paid with us! We ensure premium quality solution document along with free turntin report!

All rights reserved! Copyrights ©2019-2020 ExpertsMind IT Educational Pvt Ltd