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Explain Thermoplastic materials.
Thermoplastic materials: The properties of such plastic materials do not change considerably when they are melted and after that cooled and solidify. They can be repeatedly dissolved or melted in various solvents. They are additional elastic, less brittle and do not lose elasticity while subjected to prolonged heating. They are less apt to age thermally. Again and again they can be remoulded in any shape after heating. Several of them possess extraordinary high insulating properties and they are water repellent. They are polymers of linear structure that is their molecules are elongated and are like thread. This, kind of structure is soluble, fusible, highly plastic, able of forming thin flexible threads as well as films. Illustrations are Polytetra Flouroethylene (P.T.F.E. or Teflon) and Polyvinyl Chloride (P.V.C.).
Cross Section of NMOS with Channel Formed: ON state A metal-oxide-semiconductor field-effect transistor (MOSFET) is based upon the modulation of charge concentration through a
Q. Show Proper cash management? Proper cash management: cash management is a important task of finance management he has to access to various cash needs at the difference time
design a 32:1 multiplexer using two 16:1 multiplexer
Interpoles and Compensating Windings: The most generally used method for aiding commutation is by providing the machine with inter poles, also known as commutating poles, or si
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connection of STS MUX/DMUX
Hello sir, m engineering final year student, we made a project as I mentioned above, I wanna add some extra feature on it, meant to modified it...want to add up some extra feature
A LIT (linear time-invariant) system, impulse response h [ n ], is described by: (a) Show the block-diagram representation for this FIR filter (only use multiplier, adder
Hall Effect is associated with (A) Conductors. (B) Semiconductors. (C) Thermistors. (D)Solders. Ans: Hall Effect is associated with semiconductors.
ELEC 132 COURSEWORK – ADC This work will be assessed based on program demonstration (during lab sessions) and design. You will also have to submit your c-source codes as word o
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