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Mask Alignment and Exposure
One of the most significant steps in the photolithography process is mask alignment. A mask or "photomask" is a square glass plate with a patterned emulsion of metal film on single side. The mask is aligned with the wafer, so that the pattern can be transfer onto the wafer surface. Every mask after the first one must be aligned to the last pattern.
Once the mask has been accurately allied with the pattern on the wafer's surface, the photo resist is exposed by the pattern on the mask with a high intensity ultraviolet light. There are three primary exposure methods: contact, proximity, and projection. They are shown in the figure below.
Identify a major process equipment or operation in your work environment which has the highest risk and develop a detailed report on 1) process hazard analysis (PHA) and 2) HZOP to
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Methane containing 4 mol% N 2 is flowing through a pipleline at 105.1 kpa and 22 °C. To check this flow rate, N 2 at the same temperature and pressure are introduced to the piple
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Strawberries contain about 20 wt% solids and 80 wt% water. To make strawberry jam, crushed strawberries and sugar are mixed in a 40:60 mass ratio, and the mixture is heated to evap
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