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Mask Alignment and Exposure
One of the most significant steps in the photolithography process is mask alignment. A mask or "photomask" is a square glass plate with a patterned emulsion of metal film on single side. The mask is aligned with the wafer, so that the pattern can be transfer onto the wafer surface. Every mask after the first one must be aligned to the last pattern.
Once the mask has been accurately allied with the pattern on the wafer's surface, the photo resist is exposed by the pattern on the mask with a high intensity ultraviolet light. There are three primary exposure methods: contact, proximity, and projection. They are shown in the figure below.
#question.Q1 What is wrong with each of the following attempts to write an electron configuration? Justify your answer with suitable explanation. (a) 1s22s3 (b) 1s22s22p23s2 (c) 1s
Report Note: What do you observe? Do you realise that the common chemicals you have been hadling casually at your laboratory (if any, with which you are working) are quite
PROCESSING OF BILL FOR PAYMENT : Your Counsellor will give you one bill. In that bill, you make relevant entries of the following statement using your imagination.
what am i going to do nw
Point defects: Point defects are defects which are not extended in space in any dimension. There is no strict limit for how small a "point" defect should be, but typically the ter
single beam AAS
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Properties of filament and contact materials. The Filament materials must have low resistance temperature co-efficient, high melting point, high mechanical strength, ductility
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A mixture of 44 mol % of a component A and 56 mol % of component B is to be separated in a distillation column. The concentration of A in the distillate is 97 mol % A and 94 % B in
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