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Mask Alignment and Exposure
One of the most significant steps in the photolithography process is mask alignment. A mask or "photomask" is a square glass plate with a patterned emulsion of metal film on single side. The mask is aligned with the wafer, so that the pattern can be transfer onto the wafer surface. Every mask after the first one must be aligned to the last pattern.
Once the mask has been accurately allied with the pattern on the wafer's surface, the photo resist is exposed by the pattern on the mask with a high intensity ultraviolet light. There are three primary exposure methods: contact, proximity, and projection. They are shown in the figure below.
Refractoriness under load (RUL): This represents the resistance of a refractory material to the combined efforts of heat and load. RUL is the temperature at which the deformation
Hardness is 160 ppm and flow rate is 40 m3/hr ,I want to know the amount resin quantity required.Please give me a solution with details.
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REQUIREMENTS Workbook cum Lab. manual Block 1 (LT-1 course) Pencil Pen Eraser Scale Coloured pens
PROCEDURE : Visit any lab (physics, chemistry or biology) of your study centre or any other you can get access to and note its features. To guide you through we have listed below
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1. a)Explain the construction and working of catalytic converter with a neat diagram. b) How much of rise in temperature of water occurs when 0.222 kg of a fuel is burnt in bom
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