Explain mask alignment and exposure, Chemical Engineering

Assignment Help:

Mask Alignment and Exposure

One of the most significant steps in the photolithography process is mask alignment. A mask or "photomask" is a square glass plate with a patterned emulsion of metal film on single side. The mask is aligned with the wafer, so that the pattern can be transfer onto the wafer surface. Every mask after the first one must be aligned to the last pattern.

Once the mask has been accurately allied with the pattern on the wafer's surface, the photo resist is exposed by the pattern on the mask with a high intensity ultraviolet light. There are three primary exposure methods: contact,  proximity, and projection. They are shown in the figure below.  

 

2123_Untitled.png


Related Discussions:- Explain mask alignment and exposure

Water, what is break point on chlorination

what is break point on chlorination

Advantages and disadvantages of cold working, Advantages of cold working ...

Advantages of cold working (i)  No heat is needed. (ii)  Better surface finish is get. (iii)  Superior dimension control. (iv)  Improved strength and hardness properti

Can alsocoholic acidity of Maida be estimated in 1 hour, Is there any metho...

Is there any method fro estimation of alcoholic acidity of maida less than 24 Hrs.

Introduction-study of design and features of a laboratory, INTRODUCTION : ...

INTRODUCTION : Here you were introduced to the essential features of a good laboratory. Since no two labs are alike, it is important to know the design and organisation of the lab

Thermodynamics, prove that work is a path function

prove that work is a path function

Flash and fire points, Q.   Define flash and fire points and its determinat...

Q.   Define flash and fire points and its determination.                                 OR Write short note on: Flash and fire points. Ans. Flash and fire points:

The functions of the oxide layer, The functions of the oxide layer are to: ...

The functions of the oxide layer are to: 1.  mask against diffusion or ion-implant 2.  passivate the surface electrically and chemically 3.  isolate one device from another

iron-carbon alloy , It is desired to generate an iron-carbon alloy that ha...

It is desired to generate an iron-carbon alloy that has a minimum hardness of 200 HB and a minimum ductility of 35%RA. Is such an alloy possible? If so, what will be its compositio

Liquid holdup, can anyone tell me something about this term

can anyone tell me something about this term

Write Your Message!

Captcha
Free Assignment Quote

Assured A++ Grade

Get guaranteed satisfaction & time on delivery in every assignment order you paid with us! We ensure premium quality solution document along with free turntin report!

All rights reserved! Copyrights ©2019-2020 ExpertsMind IT Educational Pvt Ltd