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What is Metallization Metallization is the fabrication step in which proper interconnection of circuit elements is made. Aluminum is a popular metal used to be linked ICs, bo
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A double riveted double cover butt joint is used for connecting plates 1.2 cm thick. The diameter of the rivets is 2.2 cm. The permissible stresses in tension - 100 N/mm2 The per
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Properties of filament and contact materials. The Filament materials must have low resistance temperature co-efficient, high melting point, high mechanical strength, ductility
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Materials used for DC applications are: Iron and low-carbon steels (maximum carbon 0.05 %) • Iron-Nickel alloys (Permalloy) • Iron-Cobalt alloy (Permendur)
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