What is the profile of the structure

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Reference no: EM131794430

A damascene process is used to fabricate a tungsten via through a SiO2 dielectric layer. First the SiO2 dielectric layer is deposited, with a thickness of 1 p.m.

A via hole is etched in the SiO₂, and W is blanket deposited by CVD. Right after the W deposition. the Degree of Planarization (DOI;) equals 1.0. and the thickness of the W directly above the dielectric layer is equal to 0.8 µm.

A plasma etch back of the W layer is now done to remove the W that covers the top of the dielectric layer, and leaving the W only in the via hole.

If the etch rate of the W in the etch-back process is 5.0 nm sec;, and the etch selectivity of W with respect to SiO₂ is 4:1, what is the profile of the structure after 180 sec of etching? Specify the heights of the W and SiO₂ layers in am.

(Neglect any variations in thicknesses or etch rate.)

Reference no: EM131794430

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