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What intermolecular force holds together the 2 strands of DNA and is also important for the secondary and tertiary structure of proteins?
What is the principal product when p-toluidine is treated with sodium nitrite and hydrochloric acid at 0-5 degrees Celcius
Explain why does CH2Cl2 solvent (lower layer) have higher density than water while non-chlorinated solvents like hexanes and ether (top layer) have lower density than water, i.e. Explain what exactly is it about Cl that causes this difference
carbon disulfide burns with oxygen to form carbon dioxide and sulfur dioxide in the following mannercs2 3o2 rarr co2
If [a = 2.84 (+/-) 0.02], [b = 5.02 (+/-) 0.04], [c = 21.71 (+/-) 0.06], and [d = 9.49 (+/-) 0.04], calculate the absolute uncertainty in y if y = (a+b)/(c-d).
a .900g sample of water is injected into a 10.0 liter flask at 55 degrees c. how much h2o l remains if any remains in
What is the maximum kinetic energy of a photoelectron ejected from cesium by 555 nm light? Note that if the wavelength of the light used to irradiate the cesium surface becomes longer than 660 nm, no photoelectrons are emitted.
A specific steroid has ?max = 213 nm and molar absorptivity ? = 11,500. What is the concentration of the compound in a solution whose absorbance at 213 nm is A = 0.060 with a sample pathlength of 1.00 cm?
Depict skeletal structure of major organic product produced when benzoyl chloride reacts with 2-methylpropanoic acid in the presence of weak base, pyridine
Explain what is the structure of the ICI2- ion. Examine the bonding in ICI2- by whatever the identical model(s) you feel is (are) appropriate. Explain how does the structure compare to the structure of xenon difluoride.
Define the following reaction in a closed reaction flask. If 1.50 atm of gas A is allowed to react with 0.500 atm of gas B as well as the reaction goes to completion at constant temperature and volume, explain what is the total pressure in the rea..
Determine the pH of each of the following solutions. (a) 0.382 M hypochlorous acid (weak acid with Ka = 3e-08). (b) 0.900 M hypoiodous acid (weak acid with Ka = 2.3e-11). (c) 0.597 M pyridine (weak base with Kb = 1.7e-09).
Solder is used in the electronics industry because it has a low melting point and can make durable electrical connections between copper wires. Electronic solder is an alloy of tin and lead.
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