Reference no: EM131034247
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Techniques for Flexible Microelectronics Fabrication
Flexible microelectronics are integrated circuits, which implemented on flexible substrates. In practice, microelectronics are a subfield of the electronics field, where this field is related to the investigation, analysis and manufacturing of small electronic components and designs. Generally, they are made from semiconductor materials. Some of the available components in a microelectronics equivalent are conductors, insulators, resistors, capacitors, transistors, diodes and inductors. On the other hand, the main used wiring technique in microelectronics are the wire bonding. Flexible microelectronic technology represents assembling electronic circuits based on mounting electronic devices on specific flexible substrates, which generally include metal foils, thin glasses, polymers and organic-inorganic hybrids. Each substrate is a part of the general electronic structure, which also includes front-plane, backplane electronics and encapsulation (Cheng and Wagner, 2009).
Attachment:- Techniques for Flexible.rar
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