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A chip that is of length L = 5 mm on a side and thickness t = 1 mm is encased in a ceramic substrate, and its exposed surface is convectively cooled by a dielectric liquid for which h = 150 W/m2 · K and T8 = 20°C.
In the off-mode the chip is in thermal equilibrium with the coolant (Ti = T8). When the chip is energized, however, its temperature increases until a new steady-state is established. For purposes of analysis, the energized chip is characterized by uniform volumetric heating with q = 9 x 106 W/m3 · Assuming an infinite contact resistance between the chip and substrate and negligible conduction resistance within the chip, determine the steady-state chip temperature Tf' Following activation of the chip, how long does it take to come within 1°C of this temperature? The chip density and specific heat are p = 2000 kg/m3 and c = 700 J/kg · K, respectively.
Package Design Brief: Assume you are the packaging engineer for a large consumer products company. In this company, the Packaging Design Briefs are initiated by the marketing group and forwarded to the Package Engineering group.
Define dynamic viscosity, Determine the centroid, Pressure due to the height of liquid, Advantage of changing the liquid, Calculate the total moment about the hinge of the seal gate.
DOF system and Find the differential equation describing the system
Write a paper on Boyle's law and describe Compression and Combustion stroke . Also explain Charles's law and illustrate SI engine and CI engine.
To Verify the law for parallelogram of forces, law for triangle of forces and law of polygon of forces. These laws are very useful to calculate unknown forces in very short time.
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Wind turbines are becoming more and more common as a method of energy production, wind turbines by their very nature are dynamic and are subject to and create their own internal and external kinematics and kinetics.
8 x product engineering and design review (week 2 – 12), ~3 pages per item which must contain a brief description of the product then delve into concepts such as materials selection, manufacturing methods, life cycle analysis, recyclability and overa..
Design of absorption column and the cooler. Process design of other units should be completed along with pipe sizes.
Determine maximum total bending moment (static plus dynamic) of the beam under steady-state conditions.
Determine the magnitude of the horizontal and vertical components of the force of the water on the gate.
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