How much stress is induced in the film due to the cooling

Reference no: EM131794415

Sip, is deposited on a Si wafer at 800^°C.

How much stress is induced in the film due to the cooling of the wafer from 800^°C to 25^°C? Is the stress tensile or compressive?

Assume no intrinisic stress in the film and no stress relaxation processes.

The response must be typed, single spaced, must be in times new roman font (size 12) and must follow the APA format.

Reference no: EM131794415

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