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A 250 mm diameter silicon wafer has a processable area that is circular with a diameter = 225 mm. The IC chips that will be fabricated on the wafer surface are square with 20 mm on a side. However, the processable area on each chip is only 18 mm by 18 mm. The density of circuits within each chip's processable area is 465 circuits per mm2 .
(a) How many IC chips can be placed onto the wafer?
(b) Using Rent's Rule with C = 4.5 and m = 0.35, how many input/output terminals (pins) will be needed for each chip package?
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