Reference no: EM13946099

A novel scheme for dissipating heat from the chips of a multichip array involves machining coolant channels in   the   ceramic  substrate  to   which   the   chips   are attached.  The  square  chips  (Lc  = 5 mm)  are  aligned above  each  of  the  channels,  with longitudinal and transverse  pitches  of  SL  = ST  = 20 mm.  Water  flows through the square cross section (W = 5 mm) of each channel  with  a  mean velocity  of  um  = 1 m/s,  and  its properties  may  be  approximated  as  p = 1000 kg/m3, cp  = 4180 J/kg · K, µ, = 855 X 10-6  kg/s· m, k = 0.610 W/m · K, and Pr = 5.8. Symmetry in the transverse direction dictates the existence of equivalent conditions for each substrate section of length Ls and widthST.

(a) Consider a substrate whose length in the flow direction is Ls = 200 mm, thereby providing  a total ofNL = 10 chips attached in-line above each flow channel. To a good approximation, all the heat dissipated by the chips above a channel may be assumed to be transferred to the water flowing through the channel. If each chip dissipates 5 W, what is the temperature rise of the water passing through the channel?

(b) The chip-substrate contact resistance is Rt",c = 0.5 X 10-4  m2 · K/W,  and  the  three-dimensional conduction  resistance  for  the  Ls  X ST    substrate section  is  Rcond  = 0.120 K/W.  If  water  enters  the substrate  at  25°C  and  is  in  fully  developed  flow, estimate  the  temperature  Tc   of  the  chips  and  the temperature Ts  of the substrate channel surface.