Dimensionless parameter used to describe potential

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1. Gold is commonly used in semiconductor packaging to form interconnections (also known as interconnects) that carry electrical signals between different devices in the package. In addition to being a good electrical conductor, gold interconnects are also effective at

2. The Knudsen number, Kn = Amfp/L, is a dimensionless parameter used to describe potential micro- or nanoscale effects. Derive an expression for the ratio of the thermal resistance due to molecule-surface collisions to the ther- mal resistance associated with molecule-molecule colli- sions, Rt,m-s/Rt,m-m, in terms of the Knudsen number, the thermal accommodation coefficient at, and the ratio of specific heats y, for an ideal gas. Plot the criti- cal Knudsen number, Kncrit, that is associated with Rt,m-s /Rt,m-m = 0.01 versus at, for y = 1.4 and 1.67 (corresponding to air and helium, respectively).

Reference no: EM13947523

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