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1) For integrated circuits, Al lines are commonly placed on Si to act as electrical conductors between different parts of the device. Assuming that the Al is deposited at a temperature of 300oC, determine the CTE (Coefficient of Thermal Expansion) mismatch at the Al-Si interface as follows:
a) First, determine the % change in length of the Al upon cooling to room temperature, 20oC (assume
CTE = 22 x 10-6/oC).
b) Next, determine the % change in length of the Si upon cooling (assume CTE = 3 x 10-6/oC).
c) determine the extent of the strain (% difference) that has occurred at the interface? Do you think this is enough to cause the interface to fail?
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