Determine the coefficient of thermal expansion

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Reference no: EM13704554

For integrated circuits, Al lines are commonly placed on Si to act as electrical conductors between different parts of the device. Assuming that the Al is deposited at a temperature of 300^oC, determine the CTE (Coefficient of Thermal Expansion) mismatch at the Al-Si interface as follows:

a) First, determine the % change in length of the Al upon cooling to room temperature, 20^oC (assume CTE = 22 x 10-6/^oC).

b) Next, determine the % change in length of the Si upon cooling (assume CTE = 3 x 10-6/^oC).

c) Determine the extent of the strain (% difference) that has occurred at the interface? Do you think this is enough to cause the interface to fail?

Reference no: EM13704554

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