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HEAT TRANSFER DESIGN PROJECT - DESIGN OF A HEAT SINK FOR A COMPUTER CHIP
A heat sink is to be designed for a hot silken chip to remove 105.7 W to keep the chip below a maximum temperature of 60oC. The computer chip is installed inside an enclosure which is open in the front and back with dimensions H10.0 x W20.0 x L20.0 cm, and cooling is done by a fan blowing air at a velocity of 3.5 m/s at a temperature of 27 K over the chip. The heat sink is to be designed so that it can fit inside the enclosure with the fins parallel to the direction of airflow.
The following restrictions are imposed on the design of the heat sink:
The following assumptions are made while designing the heat sink:
Your final report should include at a minimum
Hand calculations should be added to the end of the report as an appendix.
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