Cooling system for microprocessors

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Reference no: EM13938346

You are asked to design a system that will improve the cooling system for microprocessors that resembles the Intel Pentium®4. The Pentium 4 processor is packaged in a Flip-Chip Land Grid Array package that interfaces with the motherboard. The package consists of a processor core mounted on a substrate land-carrier. An integrated heat spreader (IHS) is attached to the package substrate and core and serves as the mating surface for processor component thermal solutions.

The figure below shows a sketch of the processor package components and how they are assembled together [3].

Reference no: EM13938346

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